november 2012 ? 2011 fairchild semiconductor corporation www.fairchildsemi.com FSA3041 ? rev. 1.0.1 FSA3041 ? high-speed 4:1 usb2.0 / mhl? / audio / uart switch FSA3041 high-speed 4:1 usb2.0 / mhl? / audio / uart switch features ? low on capacitance: 4.2 pf / 7.5 pf mhl / usb (typical) ? low power consumption: 30 a maximum ? supports mhl rev. 2.0 ? mhl data rate: 3.8 gbps ? linout swing: -1.5 v to +3.0 v (typical) ? usb 2.0 compliant ? packaged in 16-lead umlp (1.8 x 2.6 mm) ? over-voltage tolerance on all usb ports: up to 5.25 v without external components applications ? cell phones ? digital cameras description the FSA3041 is a bi-directional, low-power, high-speed, 4:1, usb2.0, mhl?, uart, and audio switch. configured as a double-pole, four-throw (dp4t) switch; it is optimized for switching between high- or full- speed usb, mobile high-definition link sources (mhl rev. 2.0 specification) , uart, and negative-swing capable audio. in addition, either usb 2.0 path can be used as a uart path. the FSA3041 contains circui try on the switch i/o pins, for applications where the v cc supply is powered off (v cc = 0 v), that allows the device to withstand an over- voltage condition. this switch is designed to minimize current consumption even when the control voltage applied to the control pins is lower than the supply voltage (v cc ). this is especially valuable in mobile applications, such as cell phones, allowing direct interface with the general- purpose i/os of the baseband processor. other applicatio ns include switching and connector sharing in portable cell phones, digital cameras, and notebook computers. figure 1. typical application ordering information part number top mark operating temperature range package FSA3041umx lz -40 to +85c 16-lead, ultrathin molded leadless package (umlp), 1.8 mm x 2.6 mm all trademarks are the property of their respective owners.
? 2011 fairchild semiconductor corporation www.fairchildsemi.com FSA3041 ? rev. 1.0.1 11 FSA3041 ? high-speed 4:1 usb2.0 / mhl? / audio / uart switch physical dimensions figure 20. 16-lead, ultrathin molded leadless package (umlp) package drawings are provided as a service to customers consi dering fairchild components. drawings may change in any manner without notice. please note the revision and/or date on the drawi ng and contact a fairchild semiconductor representative to ver ify or obtain the most recent revision. package specifications do not expand the terms of fairchild?s worldwide terms and conditions, specifically the warranty therein, which covers fairchild products. always visit fairchild semiconductor?s online packa ging area for the most recent package drawings: http://www.fairchildsemi.com/packaging/ . recommended land pattern notes: a. package does not fully conform to jedec standard. b. dimensions are in millimeters. c. dimensions and tolerances per asme y14.5m, 1994. d. land pattern recommendation is based on fsc design only. e. drawing filename: mkt-umlp16arev4. f. terminal shape may vary according to package supplier, see terminal shape variants. scale : 2x lead option 1 scale : 2x lead option 2 pin#1 ident pin#1 ident package edge top view bottom view 0.10 c 0.08 c 2.60 1.80 0.10 c 2x 2x side view 0.10 c 0.05 0.00 0.10 c a b 0.05 c 0.55 max. 0.40 1 5 9 13 16 2.10 2.90 0.40 0.663 0.563 0.225 1 (15x) (16x) 0.152 0.40 0.60 0.10 0.30 0.50 0.10 terminal shape variants 0.15 0.25 15x pin 1 non-pin 1 0.15 0.25 15x 0.30 0.50 0.15 0.25 0.30 0.50 0.15 0.25 15x 15x supplier 1 supplier 2 pin 1 non-pin 1 a b c seating plane 0.45 0.35 0.55 0.45 0.25 0.15 r0.20
? 2011 fairchild semiconductor corporation www.fairchildsemi.com FSA3041 ? rev. 1.0.1 12 FSA3041 ? high-speed 4:1 usb2.0 / mhl? / audio / uart switch
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